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Chip packaging form: BGA
Chip pin: 218pin
Chip pin spacing: 0.5mm
Adapter chip size: 9.15*9.15mm
Chip thickness: 0.982mm
Test environment: testing, burn-in, suitable for BGA chip HAST/HTOL testing
Chip test frequency: 800Mhz
Chip test current: 1A
Chip test temperature: +130°
Humidity: 85%
Test seat structure: clamshell type
Test seat material: alloy
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