Test Socket For BGA/LGA Package Test

BGA/LGA series test socket
Soldering problems or high-frequency requirements often occur

Features

Press down/flip structure test sockets
Suitable for chips with a pitch of 0.4/0.5/0.65/0.8/1.0mm
Compact design and lower test pressure
Unique structure avoids ball jamming
Replaceable limit frame
The “U” shaped shrapnel supports any shape of solder balls (with balls, without balls, residual balls – the overall contact surface drop does not exceed 0.2MM)

Materials & Performance:

Socket body: PEI
Shrapnel material: beryllium copper
Shrapnel plating: nickel gold
Operating pressure: 2.0KG min, the more Pins, the greater the pressure.
Contact resistance: 50mΩ max.
Withstand voltage test: 700V AC for 1 minute
Insulation resistance: 1,000MΩ 500V DC
Maximum current: 1A
Operating temperature: -55℃~+175℃
Service life: 15,000 times (mechanical test)