Test Socket For QFN Package Test

QFN/QFP series test socket
For RF, high current or Kelvin test needs

Features

Flip structure test sockets
Suitable for chips with a pitch of 0.4/0.5mm
Compact design and lower test pressure

Materials & Performance:

Socket body: PEI
Shrapnel material: beryllium copper
Shrapnel plating: nickel gold
Operating pressure: 2.0KG min, the more Pins, the greater the pressure.
Contact resistance: 50mΩ max.
Withstand voltage test: 700V AC for 1 minute
Insulation resistance: 1,000MΩ 500V DC
Maximum current: 1A
Operating temperature: -55℃~+175℃
Service life: 15,000 times (mechanical test)